3D Chiplet Expert

Location: Leuven (Belgium), Grenoble (France), Nice (France) or remote

About Us:
Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking colleagues to join our dynamic team and disrupt the industry together.

About What You Will Do:

We are seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

Key Responsibilities:

• Integration Architecture & Process Definition:
  Develop and define architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
  
  

• Performance Analysis & Simulation:
  Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
  
  

• Collaboration & Communication:
  Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.
  
  

• Technical Leadership:
  Provide technical leadership and project management guidance to multidisciplinary  teams.
  

About Who You Are:

• You’ve spent 5–10 years exploring the frontiers of 2.5D/3D packaging and heterogeneous integration, turning complex ideas into manufacturable systems.
  
  

• You thrive where architecture meets technology — translating ambitious concepts into elegant, high-performance designs.
  
  

• Multi-physics isn’t just theory to you; you use thermal, electrical, and mechanical simulations to see the whole system clearly.
  
  

• You’re naturally collaborative — just as comfortable in technical deep dives as you are building bridges between design, process, and system teams.
  
  

• You’re the kind of engineer who balances vision with execution: leading projects, mentoring peers, and pushing boundaries with a calm hand.
  
  

• Above all, you’re curious — drawn to the challenge of building something new and meaningful at the intersection of memory, compute, and packaging innovation.

Why Join Us:

• Work at the forefront of memory technology innovation.
  
  

• Be part of a human adventure: we value curiosity, creativity, and joy in doing exceptional work.
  
  

• Collaborate with a talented and dedicated team in a fast-paced startup environment.
  
  

• Contribute to projects shaping the future of computing and electronics.
  
  

• Enjoy a motivating total rewards package.
  
  

How to Show Your Interest:
Does the above sound like you? If you’re ready to join our team, please send us your resume and we will dive into it.

Vertical Compute is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

Join us in shaping the future of compute & memory technology — and celebrating success!